Below you will find our Manufacturing Capability
now and what is currently under development
and near completion. Make note of our Material
List & Applications. Our Quality Assurance System
is applied to arrival of material and components,
while boards are in process and when completed.
Quality and reliability are our hallmark.
| Material List & Application |
| FR-4 |
General Electronic Product |
| FR-5 |
Burn-in board, Power supply |
| BT |
PBGA, Burn-in, IC Card |
| Polyimide 85N |
Military, Burn-in, Power supply |
| Exposy 45N |
Back Plane, Burn-in, BGA... |
| Aluminum |
Power Supply, Motor Engine |
| Teflon |
RF, LNB, LNA, Base Station |
| Duroid |
RF, LNB, LNA, Base Station |
| RO3003/4003 |
RF, LNB, LNA, Base Station |
|
| Manufacturing Capability |
| Technology
Description |
Now |
Under
Development |
| Minimum Trace/Space
(inner/outer) |
5/5 mils |
4/4 mils |
| Minimum Finished Hole
Diameter |
10 mils |
6 mils |
| Maximum Aspect Ratio |
8:1 |
10:1 |
| Minimum Board Thickness
- 4 layer |
16 mils |
12 mils |
| Minimum Board Thickness
- 6 layer |
24 mils |
22 mils |
| Maximum Board Thickness |
125 mils |
125 mils |
| Minimum/Maximum Layer |
2/16 |
up to
20 |
| Minimum SMT Device Pitch |
12 mils |
10 mils |
| Minimum SMT Device Land
Width |
8 mils |
6 mils |
| Board Flatness Tolerance |
 0.7% |
0.5% |
| Layer to Layer Reg.
Tolerance |
5
mils |
4
mils |
| Impedance |
10% |
8% |
| Entek/Gold Plating |
Yes |
Yes |
|
